TXEMM | CONDUCTIVE MATERIALS CHARACTERIZATION · SILVER POWDER
Morphology, Particle Size & Surface Properties
Advanced silver powder characterization and Selection for conductive paste formulation, printing performance, and electronic applications.
Evaluate particle morphology, size distribution, sintering behavior, and key physical properties.
Particle shape, surface texture, and agglomeration
D10, D50, D90 and particle size uniformity
Thermal shrinkage and densification behavior
Density, weight loss, and specific surface area
Match your engineering questions with the most relevant silver powder characterization methods to understand material properties and performance.
Four selected grades spanning ultrafine to medium particle profiles.
Nano / Submicron
Ultrafine silver powder for low-temperature conductive systems
D50
0.12–0.22 µm
Tap density
3.2–4.2 g/cm³
Surface area
1.6–2.5 m²/g
Fine
Fine silver powder with a compact particle-size distribution
D50
0.97 µm
Tap density
5.32 g/cm³
Surface area
0.79 m²/g
Fine
Fine silver powder for controlled feature formation
D50
1.24 µm
Tap density
5.62 g/cm³
Surface area
0.7206 m²/g
Medium
Medium silver powder with two characterized datasets
D50
1.35–1.37 µm
Tap density
5.88–6.10 g/cm³
Surface area
0.478–0.484 m²/g
