TXEMM | CONDUCTIVE MATERIALS
Conductive Paste Analysis
Formulation, Rheology & Performance Characterization
Specialized analysis of conductive paste composition, printing behavior, microstructure and electrical performance.
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Ours Analysis Capabilities
Ours Analysis Capabilities
Rheology & Viscosity Analysis
Rheology & Viscosity Analysis
Viscosity vs. shear rate
Shear-thinning behavior
Thixotropic recovery (3ITT)
Temperature-dependent rheology
Formulation Analysis
Formulation Analysis
Solid content (TGA / LOI)
Organic vehicle (GC / GC-MS)
Silver powder & glass frit analysis
Comparative formulation study
Printing & Microstructure
Printing & Microstructure
Printed line width & height
Line aspect ratio & spreading
SEM / EDS microstructure analysis
Particle dispersion & interface
Process & Performance Evaluation
Process & Performance Evaluation
Drying and firing behavior (DSC/TGA)
Fired microstructure and density
Electrical resistance / sheet resistance
Formulation and process comparison
Typical Results
Typical Results
Viscosity vs Shear Rate
Viscosity vs Shear Rate
Fired Microstructure (SEM)
Fired Microstructure (SEM)
Screen-Printed Line Morphology
Screen-Printed Line Morphology
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