TXEMM | CONDUCTIVE MATERIALS
Organic Vehicle Analysis
Composition · Thermal Behavior · Rheology
Characterization of solvents, binders, and additives in conductive paste formulations.
TXEMM | CONDUCTIVE MATERIALS
Composition · Thermal Behavior · Rheology
Characterization of solvents, binders, and additives in conductive paste formulations.
Organic ingredients influence paste flow, printing, drying, and formulation stability.
Influence viscosity, evaporation, and drying behavior.
Contribute to cohesion, adhesion, and printed-film integrity.
Support wetting, dispersion, and interfacial stability.
Help control flow and structural recovery.
Modify friction and processing-related behavior.
Provide specialized functions within the formulation.
Understand the organic components that influence paste processing and performance.
Silver particles, glass frit, and organic components
Selective extraction, fractionation, or other suitable preparation approaches based on sample chemistry.
Complementary analytical techniques provide composition and structural information.
Different methods provide complementary evidence about organic components and polymer systems.
GC-MS
Identify suitable volatile organic components, including solvents.
Chromatographic profile and compound identification
Py-GC-MS
Investigate polymer chemistry through characteristic pyrolysis products.
Polymer pyrolysis fingerprint
GPC / SEC
Compare molecular-weight distributions of polymer fractions.
Molecular-weight distribution profile
Chemical Analysis
Investigate molecular structures, functional groups.
Structural and additive information